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SPECIFICATION Chipset INTEL B860 CPU Support Supports Intel® Core™ Ultra Processors (Series 2) on LGA 1851 Memory - Slots: 4x DDR5 UDIMM - Maximum Capacity: 256GB - Supported Speeds:   •...

SPECIFICATION Chipset INTEL B860 CPU Support Supports Intel® Core™ Ultra Processors (Series 2) on LGA 1851 Memory - Slots: 4x DDR5 UDIMM - Maximum Capacity: 256GB - Supported Speeds:   •...

SPECIFICATION CPU AMD Socket AM5 for Ryzen™ 9000, 8000, 7000 Series Chipset AMD X870 Chipset Memory 4x DIMM slots, up to 256GB DDR5, 8000+ MT/s (OC), Dual Channel, EXPO &...

SPECIFICATION Mode TUF GAMING Z890-PLUS WIFI News & Updates New BIOS released (10/24/2024) addressing bugs, including display issues with Windows 11 24H2. EZ Flash tool recommended for update. CPU Supports...

SPECIFICATION Chipset Intel Z890 CPU Support Intel® Core™ Ultra Processors (Series 2), LGA 1851 Memory 4x DDR5 UDIMM, up to 256GB; Speeds: 9200 - 6400 (OC) MT/s, 6400 - 4800...

SPECIFICATION Connectivity USB 2.0 (TypeC to TypeA), Bluetooth 5.1, RF 2.4GHz Sensor ROG AimPoint sensor Resolution 100~36000 DPI Max Speed 650 IPS Max Acceleration 50 G USB Report rate 1000...

SPECIFICATION Model GP-UD750GM Type Intel Form Factor ATX 12V v2.31 PFC Active PFC (>0.9 typical) Input Voltage 100-240 Vac (full range) Input Current 12-6A Input Frequency 60-50 Hz Output Capacity...

SPECIFICATION Model TUF GAMING X870-PLUS WIFI CPU AMD Socket AM5, Ryzen™ 9000/8000/7000 Series Desktop Processors Chipset AMD X870 Memory 4 x DIMM, max. 192GB DDR5, up to 8000+ MT/s (OC),...

SPECIFICATION Device Interfaces   1 x Gigabit Ethernet LAN port, 1 x Gigabit Ethernet WAN port, 1 x WPS button, 1 x power connector LED Power/ Status Antenna Type 2...

SPECIFICATION CPU AMD Socket AM5, supports AMD Ryzen™ 9000/8000/7000 Series Processors Chipset AMD X870 Memory - DDR5 4400–8200 MT/s (OC), up to 256 GB (4 slots, 64 GB per DIMM)...

SPECIFICATION Model PRIME Z890-P WIFI-CSM News & Updates - New BIOS released on 2024/10/24 addressing display issues with Windows 11 24H2. - Update via EZ Flash tool using ZIP file...

Chipset Intel B760 CPU Supports Intel® Core™ 14th/13th/12th Gen Processors, Intel® Pentium® Gold, and Celeron® Processors (LGA 1700) Memory 4x DDR4, Max. Capacity: 128GBSupported Frequencies: 5333(OC), 5200(OC), 5066(OC), 5000(OC), 4800(OC),...

SPECIFICATION Auto MDI/MDIX Yes 10/100/1000BASE-T PoE ports (802.3af/at) 16 802.3bt 90W Support No 10/100/1000BASE-T ports (Including PoE) 16 + 2 (Combo) Gigabit SFP ports 2 (Combo) Port-based Bandwidth Control Yes...

SPECIFICATION Model PRIME H610M-E D4-CSM CPU Intel® Socket LGA1700 for 13th Gen Intel® Core™ Processors & 12th Gen Intel® Core™, Pentium® Gold and Celeron® Processors* Supports Intel® Turbo Boost Technology...

SPECIFICATION Case Size Mid Tower Motherboard Support EATX (12"x10.9"), ATX, Micro-ATX, Mini-ITX Drive Bays 4 x 2.5" Bay, 2 x 2.5"/3.5" Combo Bay Expansion Slots 8 (2 additional vertical) Front...

SPECIFICATIONS Model Number MB520-KGNN-S00, MB520-WGNN-S00 Exterior Color Black, White Materials - Exterior Mesh, Steel, ABS Plastic, Tempered Glass Materials - Left Side Panel Tempered Glass Dimensions (L x W x...

SPECIFICATIONS Model Number MB520-KGNN-S00, MB520-WGNN-S00 Exterior Color Black, White Materials - Exterior Mesh, Steel, ABS Plastic, Tempered Glass Materials - Left Side Panel Tempered Glass Dimensions (L x W x...

SPECIFICATION SOCKET 1200 CHIPSET Intel® H510 Chipset MEMORY CHANNEL Dual DIMM SLOTS 2 MAX MEMORY (GB) 64 PCI-E X16 1 PCI-E GEN Gen4 PCI-E X1 1 SATAIII 4 M.2 SLOT...

SPECIFICATION MODEL NUMBER (MCB-K501L-KGNN-SR1) AVAILABLE COLOR(S) Black MATERIALS Tempered Glass (MCB-K501L-KGNN-SR1) DIMENSIONS (L X W X H) 496mm x 217mm x 469mm (incl. Protrusions), 428.7mm x 205mm x 458.5mm (excl....