|Row Cycle Time (tRCmin)||45.75ns(min.)|
|Refresh to Active/Refresh
Command Time (tRFCmin)
|Row Active Time (tRASmin)||29.25ns(min.)|
|Maximum Operating Power||TBD W*|
|UL Rating||94 V – 0|
C to +85o
C to +100o
|Power Supply||VDD = 1.2V Typical|
|VDDSPD||2.2V to 3.6V|
|Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/heatsink
In 1987, Kingston® entered the market with a single product. Founders John Tu and David Sun addressed a severe shortage of surface-mount memory chips with a memory module that would serve to redefine industry standards for years to come.
Combining one of the most extensive and stringent testing processes in the memory industry, an exceptional free tech support centre and a consistent roll-out of innovative technologies, Kingston Technology has continually set industry standards of quality and reliability throughout its history.
Reliability is the cornerstone of the Kingston product strategy. It has played a key role in maintaining the long-term relationships developed over the years with customers. Kingston remains committed to exceeding industry standards with every new development while maintaining the signature reliability of its products.
Kingston serves an international network of distributors, resellers, retailers and OEM customers on six continents. The company also provides contract manufacturing and supply chain management services for semiconductor manufacturers and system OEMs.