Essentials |
|
Capacity | 512 GB |
Status | Launched |
Launch Date | 03’18 |
Lithography Type | 3D2 QLC |
Use Conditions | PC/Client/Tablet |
Performance |
|
Sequential Read (up to) | 1500 MB/s |
Sequential Write (up to) | 1000 MB/s |
Random Read (8GB Span) (up to) |
90000 IOPS
|
Random Write (8GB Span) (up to) | 220000 IOPS |
Power – Active | 0.1 W |
Power – Idle | 0.040W |
Reliability |
|
Vibration – Operating | 2.17 GRMS |
Vibration – Non-Operating | 3.13 GRMS |
Shock (Operating and Non-Operating) | 1000 G |
Operating Temperature Range | 0°C to 70°C |
Endurance Rating (Lifetime Writes) | 100 TBW |
Mean Time Between Failures (MTBF) | >= 1.6 million hours |
Uncorrectable Bit Error Rate (UBER) | <1 sector per 10^15 bits read |
Package Specifications |
|
Weight | <10 grams |
Form Factor | M.2 22 x 80mm |
Interface | PCIe NVMe 3.0 x4 |
Advanced Technologies |
|
Enhanced Power Loss Data Protection | No |
Hardware Encryption | AES 256 bit |
High Endurance Technology (HET) | No |
Temperature Monitoring and Logging | No |
End-to-End Data Protection | Yes |
Intel® Smart Response Technology | Yes |
Intel® Remote Secure Erase | No |
Intel® Rapid Start Technology | Yes |
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